CM1263 ? 02SE
PACKAGE DIMENSIONS
SOT ? 553, 5 LEAD
CASE 463B ? 01
ISSUE B
5
D
? X ?
1 2
e
4
3
E
? Y ?
b 5 PL
0.08 (0.003)
M
X Y
A
L
H E
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM
A 0.50 0.55 0.60 0.020 0.022
b 0.17 0.22 0.27 0.007 0.009
c 0.08 0.13 0.18 0.003 0.005
D 1.50 1.60 1.70 0.059 0.063
E 1.10 1.20 1.30 0.043 0.047
e 0.50 BSC 0.020 BSC
L 0.10 0.20 0.30 0.004 0.008
H E 1.50 1.60 1.70 0.059 0.063
MAX
0.024
0.011
0.007
0.067
0.051
0.012
0.067
SOLDERING FOOTPRINT*
1.35
0.0531
0.3
0.0118
1.0
0.0394
0.5
0.5
0.0197 0.0197
0.45
0.0177
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
SCALE 20:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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CM1263 ? 02SE/D
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